Chip model: TEC1-12730SR
External dimensions: 62 *62 * 4.2mm ± 0.1
Maximum temperature difference: 65 ° C
Maximum voltage: 15.8V
Recommended voltage: 12V
Assembly pressure: 85N/cm2
Maximum cooling capacity: 260W
Maximum current: 30A
Weight:68g
Packaging process: surrounded by 704 silicone rubber seal or epoxy resin seal
Packaging standard: bubble box packaging, storage conditions, environmental temperature -10 ° C~40 ° C,